United Microelectronics Corporation (NYSE:UMC, TWSE: 2303))))) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products. The project offers an end-to-end solution for integrating memory and processor with silicon stacking technology, catering to the rising demand for efficient computing at the device level as artificial intelligence expands from cloud to the edge.
The W2W 3D IC project with partner collaboration targets edge AI applications – such as home and industrial IoT, security, and smart infrastructure – requiring mid-to-high range computing power, extensive and customizable memory modules, and relatively low power consumption. The platform is expected to be ready in 2024 following the completion of system-level verification, ensuring a seamless process for customers. It will resolve various heterogeneous integration challenges including alignment of wafer stacking rules between logic and memory fabs, effective design flow for vertical wafer integration, and a proven package and testing path.
