Nvidia Corp (NASDAQ:TSM).
Industry insiders see FOPLP as a viable alternative to CoWoS due to TSMC’s limited CoWoS capacity and the rising demand for AI chips driven by generative AI applications.
A senior executive from China Wafer Level CSP stated that FOPLP could reduce costs and enhance capacity despite having weaker technical specifications than CoWoS due to a more extensive process size, the Digi Times reports.
Also Read: AMD Grabs 33% of Server CPU Market and Prepares for Major Processor Launch: Report
Packaging companies are preparing to offer FOPLP services, and Yole Group predicts its market share will grow from 2% in 2022 to 8% by 2028, driven by higher yields and cost efficiency.
Fan-Out Wafer Level Packaging (FOWLP) remains the mainstream fan-out packaging type.
Meanwhile, analysts hailed Nvidia’s earning beat last week as the semiconductor industry’s highlight. They noted Nvidia as the premier accelerated compute & Gen AI supplier backed by Blackwell chip production plans and U.S. Big Tech customers.
Nvidia stock gained over 184% in the last 12 months. Investors can gain exposure to the stock via VanEck Semiconductor ETF (NASDAQ:SMH)
and Return Stacked Bonds & Managed Futures ETF Grizzle Growth ETF (NYSE:DARP).
Price Actions: NVDA shares traded higher by 0.89% at $1,149.10 premarket at the last check on Wednesday.
Disclaimer: This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors.
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