Nova (NASDAQ:NVMI) announced today that one of the world’s leading foundry manufacturers recently selected Nova PRISM 2 for its advanced packaging process steps.
Advanced packaging applications such as 3D-stacking and heterogeneous integration help maintain Moore’s law and achieve higher bandwidth, lower latency, lower power, and higher yield. The new advanced packaging schemes necessitate process steps such as hybrid bonding and demand tighter process control on smaller, denser interconnects and tall, highly complex multilayered structures.
The Nova PRISM platform, using its unique spectral interferometry technology, has a proven advantage in addressing these new challenges and providing manufacturers with the relevant insights to achieve successful production. Nova PRISM 2 is the newest generation of the platform, offering the improved sensitivity and accuracy required to address the R&D and high-volume manufacturing metrology needs of advanced process nodes.
“This selection by one of the world’s leading semiconductor foundries demonstrates the growing value of Nova’s innovative metrology portfolio beyond traditional front-end process steps,” said Gaby Waisman, Nova’s president and CEO. “The increasing complexity of advanced packaging architecture requires novel in-line metrology solutions, and our market-leading portfolio allows manufacturers to utilize optical CD and spectral interferometry technologies in completely new ways. We are encouraged by the keen interest our customers are showing in what we can do to help them overcome the growing challenges in advanced packaging.”
The Company further reported that it expects to recognize initial revenues from the selection soon within the calendar year 2023, and that presently it is undergoing additional evaluations and demos by several other IC manufacturers for similar advanced packaging applications.
