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Cadence And Samsung Foundry Accelerate Design For AI And 3D-IC Semiconductors

Cadence.AI digital and analog tools optimized for advanced node SF2 gate-all-around (GAA), driving enhanced quality of results and accelerating circuit process node migration Cadence's best-in-class 3D-IC technology enabled for all of Samsung Foundry's multi-die integration offerings, accelerating the design and assembly of stacked chiplets
byBenzinga Newsdesk
June 12, 2024
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  • Cadence.AI digital and analog tools optimized for advanced node SF2 gate-all-around (GAA), driving enhanced quality of results and accelerating circuit process node migration
  • Cadence’s best-in-class 3D-IC technology enabled for all of Samsung Foundry’s multi-die integration offerings, accelerating the design and assembly of stacked chiplets
  • Cadence’s broad IP portfolio and tools for next-generation AI designs will enable customers to achieve first-pass silicon success and accelerate time to market

Cadence Design Systems, Inc. (NASDAQ:CDNS) today announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes. The ongoing collaboration between Cadence and Samsung significantly advances system and semiconductor development for the industry’s most demanding applications, including AI, automotive, aerospace, hyperscale computing and mobile.

 
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