Analyst Ming-Chi Kuo Gives “Some Prediction Updates About Nvidia’s Next-Generation AI Chip R-Series/R100” – Medium

https://medium.com/@mingchikuo/%E4%B8%80%E4%BA%9B%E9%97%9C%E6%96%BCnvidia%E4%B8%8B%E4%B8%80%E4%BB%A3ai%E6%99%B6%E7%89%87r%E7%B3%BB%E5%88%97-r100%E7%9A%84%E9%A0%90%E6%B8%AC%E6%9B%B4%E6%96%B0-some-prediction-updates-about-

https://medium.com/@mingchikuo/%E4%B8%80%E4%BA%9B%E9%97%9C%E6%96%BCnvidia%E4%B8%8B%E4%B8%80%E4%BB%A3ai%E6%99%B6%E7%89%87r%E7%B3%BB%E5%88%97-r100%E7%9A%84%E9%A0%90%E6%B8%AC%E6%9B%B4%E6%96%B0-some-prediction-updates-about-nvidias-next-generation-ai-chip-6624c17c6e95

 

 

  1. Nvidia’s next-generation AI chip, the R-series/R100 AI chip, will enter mass production in 4Q25, and the system/rack solution will likely start mass production in 1H26.
  2. R100 will use TSMC’s N3 node (vs. TSMC’s N4P for B100) and CoWoS-L packaging (same as B100).
  3. R100 adopts about 4x reticle design (vs. B100’s 3.3x).
  4. The interposer size for R100 has yet to be finalized. There are 2–3 options.
  5. R100 will be equipped with eight HBM4 units.
  6. GR200’s Grace CPU will use TSMC’s N3 process (vs. TSMC’s N5 for GH200 & GB200’s Grace CPU).
  7. Nvidia realizes that the power consumption of AI servers has become a bottleneck for customers’ procurement and data center construction. Hence, the R-series chips and system solutions focus on improving power consumption in addition to enhancing AI computing power.
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