https://medium.com/@mingchikuo/%E4%B8%80%E4%BA%9B%E9%97%9C%E6%96%BCnvidia%E4%B8%8B%E4%B8%80%E4%BB%A3ai%E6%99%B6%E7%89%87r%E7%B3%BB%E5%88%97-r100%E7%9A%84%E9%A0%90%E6%B8%AC%E6%9B%B4%E6%96%B0-some-prediction-updates-about-nvidias-next-generation-ai-chip-6624c17c6e95
- Nvidia’s next-generation AI chip, the R-series/R100 AI chip, will enter mass production in 4Q25, and the system/rack solution will likely start mass production in 1H26.
- R100 will use TSMC’s N3 node (vs. TSMC’s N4P for B100) and CoWoS-L packaging (same as B100).
- R100 adopts about 4x reticle design (vs. B100’s 3.3x).
- The interposer size for R100 has yet to be finalized. There are 2–3 options.
- R100 will be equipped with eight HBM4 units.
- GR200’s Grace CPU will use TSMC’s N3 process (vs. TSMC’s N5 for GH200 & GB200’s Grace CPU).
- Nvidia realizes that the power consumption of AI servers has become a bottleneck for customers’ procurement and data center construction. Hence, the R-series chips and system solutions focus on improving power consumption in addition to enhancing AI computing power.