ACM Research, Inc. (“ACM”) (NASDAQ:ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the receipt of a purchase order for its Ultra C b backside clean and bevel etch tool from a major U.S. semiconductor manufacturer. The tool is expected to be shipped to the prospective customer’s U.S. facility in the second quarter of 2024.
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